advanced-packaging

Turn existing CAE files into structured text an agent can use — COMSOL, Abaqus, Fluent, HFSS, Icepak, FloTHERM — plus solver detection, script linting, and live solver sessions. Strong coverage for electronics thermal and advanced packaging.

A curated list of semiconductor industry resources, with a deliberate bias toward sub-10nm logic, lithography, process technology, and advanced packaging.

True 3D Global Placement GUI Viewer -- An interactive 3D visualization demo for 3D IC placement. Built for the era of Huawei's Tao (τ) Law and Logic Folding, where 3D placement becomes the key enabler for next-generation chip density beyond Moore's Law.

🔲 Chip substrate — 28-verb semiconductor stack (architecture / design / EDA / process / packaging / NPU / PIM / 3D / photonic / RTL-gen / yield / consciousness-chip).

免费开源的中文半导体与先进封装课程：40 课，覆盖 Chiplet、HBM、2.5D/3D、工程约束、制造经济学与产业研究。

Amkor Technology — independent third-party profile of a public API surface, by API Evangelist. Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries.

The AI Constraint Relay: moving bottlenecks across power, labour, equipment and cost incidence. DOI 10.5281/zenodo.20586863

Syenta — independent third-party profile of a public API surface, by API Evangelist. Syenta is an Australian deep-tech semiconductor company (founded 2022, spun out of the Australian National University, with teams across Australia, Europe and the United States) building manufacturing equipment for advanced chip packaging.