ic-packaging

Here are 2 public repositories matching this topic...

rajul-kk / thermo-3dic-surrogates

Physics-informed thermal surrogate benchmark for 3D/2.5D IC packaging — PINN, FNO/WHNO, PI-DeepONet, and autoregressive operators trained on real 3D-ICE ground truth across 8 geometries (single-die, TSV stacks, chiplets, CoWoS+HBM).

pytorch pinn 3d-ic explainable-ai foundation-models chiplet cowos operator-learning deeponet fourier-neural-operator ic-packaging chip-thermal-anlysis

Updated Jul 3, 2026
Python

bayerworld233-svg / wlp-warpage-explorer

Star

Analytical warpage & thermo-mechanical stress toolkit for wafer-level packaging (WLP): Stoney / Timoshenko / N-layer laminate models, interactive Streamlit dashboard, validated against classical closed-form results.

thermomechanical warpage wafer-level-packaging semiconductor-packaging ic-packaging

Updated Aug 8, 2026
Python

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